Last Update 06-04

G.SKILL x Cooler Master Launch In-Fan Memory for Enhanced High-Frequency Stability

Cooler Master and G.SKILL are showcasing the MasterDimm AC series at Computex 2026. This is a new line of DDR5 memory modules featuring a thickened heatsink design, with the core selling point being its built-in active cooling system within the module.

Image courtesy of @Cooler Master, copyright belongs to the original author

The design aims to ensure that high-capacity and ultra-high-frequency DDR5 modules maintain stable performance under sustained high-load conditions (not just short benchmark tests). With an integrated noise-optimized blower fan and dedicated air-guide fins, the MasterDimm AC is designed to tame the heat generated by high-performance, low-latency operations.

Feature	Specification & Benefit
Thermal Performance	Active cooling provides up to -15°C improvement in thermal performance
Intel Platform	CU-DIMM (with clock driver) up to 8400 MT/s (XMP 3.0)
AMD Platform	High-performance, low-latency 6000 MT/s CL26 (EXPO™)
Silent Design	Noise level kept below 35dB during operation
Kit Capacities	Supports up to 64GB x2 configurations

Image courtesy of @Cooler Master, copyright belongs to the original author

Previously, Origin Code showcased the VORTEX series with detachable triple fans. The launch of the MasterDimm AC marks a trend where top-tier manufacturers are officially exploring the shift of memory cooling from "passive" to "active" solutions, addressing growing demands for higher memory density and frequency.

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